Description: RF and Microwave Microelectronics Packaging, Hardcover by Kuang, Ken (EDT); Sturdivant, Rick (EDT), ISBN 3319516965, ISBN-13 9783319516967, Like New Used, Free shipping in the US
This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
Price: 144.9 USD
Location: Jessup, Maryland
End Time: 2025-01-11T10:27:08.000Z
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Book Title: RF and Microwave Microelectronics Packaging II
Number of Pages: Xii, 172 Pages
Language: English
Publisher: Springer International Publishing A&G
Publication Year: 2017
Topic: Electronics / Microelectronics, Telecommunications, Electronics / General, Microwaves
Illustrator: Yes
Genre: Technology & Engineering
Item Weight: 144.1 Oz
Item Length: 9.3 in
Author: Rick Sturdivant
Item Width: 6.1 in
Format: Hardcover
