Cardinal

Fast Chip Kit Quik SMD Removal with a Low Temperature Alloy quick inexpensive

Description: The heart of the kit is a length of Fast Chip low temperature Removal alloy. This alloy is like a solder that melts at temperatures well below that of normal solder (136°F) and stays liquid long enough to melt the existing solder, allowing you time to carefully remove the component. Simply apply a liberal amount of the included flux to the pins of the chip that you want to remove, then use a soldering iron with a flat-edge tip to heat the pins while applying the low temperature alloy. The alloy will remain liquid for a few seconds while you coat all of the connections, once you've coated the pins you should be able to lift the chip free using tweezers or a hemostat. Clean the pads thoroughly and apply fresh solder and you're ready to solder a new part in place. The Fast Chip SMD Removal Kit is a quick and inexpensive way to remove SMD components from a PCB without a hot air station using only your soldering iron. Removes QFP's, PLCC's, SOIC's, and chip components under 300 degrees Fahrenheit Enough material to remove 8-10 SMD'S The Kit Contains: 2.7 ft. Fast Chip Removal Alloy - 1 2cc tube of SRA TF5000 No Clean Rework Paste Flux and complete Instructions for SMD Removal and Cleanup

Price: 13.91 USD

Location: Lathrop, California

End Time: 2024-09-15T04:34:55.000Z

Shipping Cost: 0 USD

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Fast Chip Kit Quik SMD Removal with a Low Temperature Alloy quick inexpensiveFast Chip Kit Quik SMD Removal with a Low Temperature Alloy quick inexpensive

Item Specifics

All returns accepted: ReturnsNotAccepted

Return policy details:

EAN: 0028841772269

ISBN: 0028841772269

Package Dimensions LxWxH: 3.66x2.64x0.67 Inches

Weight: 0.04 Pounds

Type: Does not apply

Brand: SRA Soldering Products

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