Description: About this Item The item is a book hardback or cased book The Author Name is Borutzky, Wolfgang The Title is Bond Graph Modelling of Engineering Systems : Theory, Applications and Software Support Condition New Other Comments Edition_description - 2011. Pages Count - 452. Binding type - Hardcover. Content Language - English Category - TECHNOLOGY & ENGINEERING / Automation TECHNOLOGY & ENGINEERING / Mechanical TECHNOLOGY & ENGINEERING / Electronics / Circuits / General We Use Stock Images Because we have over 2 million items for sale we have to use stock images, this listing does not include the actual image of the item for sale. The purchase of this specific item is made with the understanding that the image shown in this listing is a stock image and not the actual item for sale. For example: some of our stock images include stickers, labels, price tags, hyper stickers, obi's, promotional messages, signatures and or writing which may not be available in the actual item. When possible we will add details of the items we are selling to help buyers know what is included in the item for sale. The details are provided automatically from our central master database and can sometimes be wrong. Books are released in many editions and variations, such as standard edition, re-issue, not for sale, promotional, special edition, limited edition, and many other editions and versions. The Book you receive could be any of these editions or variations. If you are looking for a specific edition or version please contact us to verify what we are selling. Gift IdeasThis is a great Christmas gift idea. Hours of ServiceWe have many warehouses, some of the warehouses process orders seven days a week, but the Administration Support Staff are located at a head office location, outside of the warehouses, and typically work only Monday to Friday. Location ID 9000z iHaveit SKU ID 165949222
Price: 235.53 USD
Location: US
End Time: 2025-01-12T07:54:10.000Z
Shipping Cost: 0 USD
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Item Specifics
Restocking Fee: No
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Fiction/Non-Fiction: Non-Fiction
Genre/Subject: TECHNOLOGY ENGINEERING / Automation
Brand: SPRINGER
Weight: 0.81
Style: NA
Title: Bond Graph Modelling of Engineering Systems Theory Application
Release Title: Bond Graph Modelling of Engineering Systems Theory Application
Record Grading: New
Sleeve Grading: New
Platform: NA
Size: NA
Film/TV Title: Bond Graph Modelling of Engineering Systems Theory Applicatio
Colour: NA
Material: NA
Department: NA
Binding Type: Hardcover
Item Height: 25.4
Main Stone: NA
Metal Purity: NA
Metal: NA
Connectivity: NA
Model: NA
Number of Pages: Xvi, 435 Pages
Publication Name: Bond Graph Modelling of Engineering Systems : Theory, Applications and Software Support
Language: English
Publisher: Springer New York
Publication Year: 2011
Subject: Engineering (General), Mechanics / General, Mechanical, Electronics / Circuits / General, Electrical
Type: Textbook
Item Weight: 29.5 Oz
Item Length: 9.3 in
Author: Wolfgang Borutzky
Subject Area: Technology & Engineering, Science
Item Width: 6.1 in
Format: Hardcover
