Description: 50 Pieces of High Thermal Conductivity Aluminum, Straight Fin Heat-sinks Intended for A4988 Chip, 3D Printers & Small Microprocessors and Micro controllers. Dimensions are (8.8)x(8.8)x(5) Millimeters Disclaimer: The dimensions of these heat-sinks are non-rectangular and are measured in millimeters. Please take into account the sizing and purpose for these heat sinks by viewing dimensions (see image). These do NOT come with any adhesive pads; and for valid and well-researched reasons. Ask yourself: Am I looking for convenience or am I looking to optimize thermal efficiency? There is no, "One Size Fits All!" solution when it comes to choosing the correct heat-sink. The overall effectiveness of heat transfer from computing chip to surroundings depends on a multitude of factors. There are three main modes of heat transfer that are central to heat-sink design. Reported Conductivity with respect to heat-sink material may be valid, but it neglects to take into account the surroundings, simply because they will always be individually unique. Considerations for Selecting the "Correct" Heat Sink:How much heat is going to be dissipated?What are the Operating Temperatures of the chip and the thermal interface material?What are the conditions of the environment where it will reside? Things like airflow, other cooling devices, other sources of heat...How might a heat sink interact with my thermal interface material? TLDR; A heat sink will be physically required to have a Thermal Resistance of less than or equal to: the (CALCULATED) product of the Thermal Resistance of the TIM by its approximate thickness, divided by the area of contact. To calculate the thermal resistance of the thermal interface material: Where (ρ) is thermal resistance of TIM in C-in/W , (t) thickness in inches, and (A) contact area in inches squared These calculations are best left to the experts. Just know that reported thermal parameters for electronics components are reported in isolation. Thermodynamics in the context of the real world never occurs in a closed-system, and that is why results tend to vary in these products. If you have any more questions about these heat sinks specifically, or want to learn more about the cutting-edge research being done in this field, feel free to reach out. I hope you learned something! Shipping: In general: I ship as soon as payment is cleared. My cutoff time for same day is 2:30 P.M EST. Orders placed after that time will go out next day provided the following day is not a holiday or Sunday. Any request for returns will be evaluated on a case-by-case basis. I am not responsible for incorrect application of these components. I am responsible for shipping the item as described and making sure they arrive undamaged. Please double check the dimensions listed throughout. Thank you for your understanding.
Price: 5.95 USD
Location: Le Roy, New York
End Time: 2024-12-01T20:30:47.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
All returns accepted: ReturnsNotAccepted
Mounting Style: Surface Mount
Thermal Resistance: 0.35 K/W
Color: Silver
Item Diameter: 0.35 in
UPC: Does not apply
Package/Case: TE0600
MPN: Does Not Apply
Material: Aluminum, Aluminum Alloy, Metal
Item Length: 0.35 in
Minimum Operating Temperature: -30 °C (-22 °F)
Suitable For: Banana Pi BPI-M1, Banana Pi BPI-M1+, Banana Pi BPI-M2+, Banana Pi BPI-M2 Beere, CPL80, DC/DC Converter, SMD-Heat Sink, Universal Square Aluminum
Brand: Unbranded
Series: T6
Type: Skived
Unit Type: Unit
Item Height: 0.5 cm (0.2 in)
Maximum Cooling Capacity: 126 W
Maximum Operating Temperature: 85 °C (185 °F)
Country/Region of Manufacture: China
Unit Quantity: 1
Fin Style: Straight Fin
Item Width: 0.35 in
