Description: 3D IC Stacking Technology, Hardcover by Wu, Banqiu; Kumar, Ajay; Ramaswami, Sesh, ISBN 007174195X, ISBN-13 9780071741958, Brand New, Free shipping in the US "The latest advances in three-dimensional integrated circuit stacking technology 3D IC Stacking Technology is a comprehensive resource on three-dimensional stacking technology, including scientific theory, processing methods, applications, and an overview of the industry's technological future. Th is targeted to semiconductor engineers and portable device designers. The quality and functional capabilities of nearly all of today's electronic devices and the production lines that produce them are dependent on key internal semiconductor components--ICs. Lithography and packaging integration are the determining factors in keeping pace with the electronics industry's quest to have more and more transistors on chip product by shrinking ICs and other related products, or by stacking the multiple chips into one chip device. This in-depth volume covers these cutting-edge technologies. 3D IC Stacking Technology Focuses on industrial applications Includes detailed fabrication processes Covers a separate fabrication step in each chapter, written by an industry expert Provides a one-stop knowledge resource for 3D IC technology Discusses future applications and device design potentials Comprehensive coverage: Design challenges; Process sequence integration; TSV etch; Chemical vapor; Barrier/ seed deposition; ECD fill; Chemical mechanical polishing; Wafer thinning; Temporary and permanent bonding; Cost of ownership"--
Price: 186.72 USD
Location: Jessup, Maryland
End Time: 2025-01-01T14:37:19.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 14 Days
Refund will be given as: Money Back
Return policy details:
Book Title: 3d Ic Stacking Technology
Number of Pages: 544 Pages
Language: English
Publisher: Mcgraw-Hill Education
Publication Year: 2011
Item Height: 0.9 in
Topic: Engineering (General), Electronics / Circuits / Integrated, Telecommunications
Illustrator: Yes
Genre: Technology & Engineering
Item Weight: 27.6 Oz
Item Length: 9.3 in
Author: Banqiu Wu, Ajay Kumar, Sesh Ramaswami
Item Width: 6.3 in
Format: Hardcover
