Description: 3D IC Stacking Technology by Wu, Banqiu; Kumar, Ajay; Ramaswami, Sesh Pages can have notes/highlighting. Spine may show signs of wear. ~ ThriftBooks: Read More, Spend Less
Price: 23.37 USD
Location: Aurora, Illinois
End Time: 2025-01-17T04:54:23.000Z
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Binding: Hardcover
Weight: 1 lbs
Product Group: Book
IsTextBook: Yes
Book Title: 3d Ic Stacking Technology
Number of Pages: 544 Pages
Language: English
Publisher: Mcgraw-Hill Education
Item Height: 0.9 in
Publication Year: 2011
Topic: Engineering (General), Electronics / Circuits / Integrated, Telecommunications
Illustrator: Yes
Genre: Technology & Engineering
Item Weight: 27.6 Oz
Author: Banqiu Wu, Ajay Kumar, Sesh Ramaswami
Item Length: 9.3 in
Item Width: 6.3 in
Format: Hardcover
